6+ day, 12+ hour ago   (386+ words) Addressing these challenges requires more than conventional multi-die integration. It calls for a system-level, signoff-ready approach that can manage full-stack interactions, unify power and multiphysics analysis, and scale efficiently enough to keep advanced AI and HPC programs on track. This…...

3+ day, 12+ hour ago   (488+ words) At the same time, process technology is just one of the key factors that enable AI-scale systems. To bring new AI products to market, a tightly integrated design ecosystem spanning implementation, verification, and signoff is critical. Through its expanded collaboration…...

4+ day, 5+ hour ago   (149+ words) Samsung Electro-Mechanics is showcasing a broad range of advanced semiconductor substrate technologies designed to support the growing demand for artificial intelligence and high-performance computing at KPCA Show 2026. The company is highlighting next-generation package substrates for AI semiconductors, including 2.5D and 2.1D technologies,…...

5+ day, 21+ hour ago   (343+ words) NanoBridge will offer a customised version of Siemens’ synthesis tool for its specialist low-power FPGA device families. Japan-based chipmaker NanoBridge Semiconductor has entered into an agreement with Siemens to use its Precision FPGA Synthesis tool for field-programmable gate array (FPGA)…...

6+ day, 4+ hour ago   (285+ words) technetbooks.com TSMC Mobilizes Semiconductor Ecosystem for Next Wave of AI Silicon TSMC is assembling its semiconductor supply chain to tackle the next wave of artificial intelligence hardware demands at its annual Open Innovation Platform forum in Silicon Valley. The…...

1+ week, 4+ day ago   (958+ words) Managing Editor’s Note: Today, we’re handing the reins over to our colleague, Jason Bodner. Jason’s diving into NVIDIA’s knockout earnings report last week and what it tells us about the direction of AI infrastructure, chips, and computing. Read on for…...

1+ week, 5+ day ago   (22+ words) TechPowerUp Automated bot check in progress Drag the handle to the target...

2+ week, 6+ day ago   (112+ words) SK Hynix is introducing advanced packaging technologies, including Intel EMIB, for its next-generation HBM solutions and plans to eventually move into the era of 3D packaging. At the 2026 Hot Chips conference, SK Hynix’s Vice President of Packaging Engin Bitget SK Hynix…...

2+ week, 5+ day ago   (997+ words) Chips are getting bigger, more modular, and much more capable as new innovations mix with existing processes and long-researched projects go mainstream. Multi-die assemblies and heterogeneous integration are becoming standard in leading-edge servers and high-end edge devices, forcing broad changes…...

2+ week, 6+ day ago   (612+ words) The $1 trillion chip era: How 2030’s super-electronics will redefine daily life Express Computer The $1 trillion chip era: How 2030’s super-electronics will redefine daily life By Hitesh Bhardwaj, GM – Semiconductors & Devices, Mitsubishi Electric India In 2030, the most consequential computer in a…...